High-performance electromagnetic shielding assemblies

ABSTRACT

A wireless communication electronic assembly can include a plurality of integrated modules each having a ground plate interfaced to each other and defining a shielding plane. Each ground plate can have a left edge and a right edge opposite each other. A plurality of wireless communication devices can be positioned on one side of the shielding plane, and a plurality of electronic devices can be positioned on the other side of the shielding plane. One or more electromagnetic shielding elements, such as gasket(s), channel strip(s), stamping element(s), etc. can be disposed between the left edge and the right edge of adjacent ground plates to electromagnetically shield the plurality of electronic devices from the plurality of wireless communication devices. The left and right edges can be recessed or offset on one side of the shielding plane. Rows and columns of integrated modules can be interfaced about a plurality of electromagnetic shielding elements. A method of installing and replacing integrated modules of an antenna array.

RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 62/370,420, filed Aug. 3, 2016, which is incorporated herein by reference in its entirety.

GOVERNMENT LICENSE RIGHTS

This invention was made with government support contract N00024-13-C-5230 awarded by the U.S. Navy. The government has certain rights in the invention.

BACKGROUND

Wireless communication assemblies, such as high-power antennas, typically include a number of “line replaceable units” such as Transmit/Receive Integrated Multichannel Modules (TRIMMs). These TRIMMs may have Concentric Circular Antenna (CCA) arrays and are usually part of an antenna assembly. TRIMMs often need to be removed and reinstalled for testing and maintenance while also providing an electromagnetic interference barrier between the CCAs and electronic devices of the antenna (and other external devices), all while not affecting RF performance of the particular high-power antenna.

Generally, many different electronic assemblies can benefit from electromagnetic interference sealing, whether on the system or subsystem levels.

BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of the invention will be apparent from the detailed description which follows, taken in conjunction with the accompanying drawings, which together illustrate, by way of example, features of the invention; and, wherein;

FIG. 1 is an isometric view of a wireless communication electronics assembly in the form of an antenna assembly/array comprising an electromagnetic shielding assembly comprising a plurality of integrated modules in accordance with an example of the present disclosure.

FIG. 2 is an isometric view of an individual integrated module of the antenna assembly/array of FIG. 1 in accordance with an example of the present disclosure.

FIG. 3A is a bottom view of a pair of adjacent integrated modules as shown in FIGS. 1 and 2.

FIG. 3B is an illustration of an edge interface of the pair of adjacent integrated modules of FIG. 3A, these forming an electromagnetic shielding assembly.

FIG. 4A is an isometric view of a first or an upper row of integrated modules stacked on a second or a lower row of supplemental integrated modules of an antenna assembly/array in accordance with an example of the present disclosure.

FIG. 4B is a detailed partial isometric view of the indicated upper portion of the antenna assembly/array of FIG. 4A.

FIG. 4C is a detailed partial isometric view of the indicated interface between the upper and lower rows of integrated modules of FIG. 4A.

FIG. 5 is a bottom view of a pair of adjacent integrated modules, similar to FIG. 3A, in accordance with an example of the present disclosure.

Reference will now be made to the exemplary embodiments illustrated, and specific language will be used herein to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.

DETAILED DESCRIPTION

As used herein, the term “substantially” refers to the complete or nearly complete extent or degree of an action, characteristic, property, state, structure, item, or result. For example, an object that is “substantially” enclosed would mean that the object is either completely enclosed or nearly completely enclosed. The exact allowable degree of deviation from absolute completeness may in some cases depend on the specific context. However, generally speaking the nearness of completion will be so as to have the same overall result as if absolute and total completion were obtained. The use of “substantially” is equally applicable when used in a negative connotation to refer to the complete or near complete lack of an action, characteristic, property, state, structure, item, or result.

As used herein, “adjacent” refers to the proximity of two structures or elements. Particularly, elements that are identified as being “adjacent” may be either abutting or connected. Such elements may also be near or close to each other without necessarily contacting each other. The exact degree of proximity may in some cases depend on the specific context.

An initial overview of technology embodiments is provided below and then specific technology embodiments are described in further detail later. This initial summary is intended to aid readers in understanding the technology more quickly but is not intended to identify key features or essential features of the technology nor is it intended to limit the scope of the claimed subject matter.

A wireless communication electronics assembly having high-performance electromagnetic shielding is disclosed. The wireless communication electronics assembly comprises a housing and an electromagnetic shielding assembly coupled to the housing. The electromagnetic shielding assembly comprises a plurality of integrated modules removably coupled to each other. Each integrated module can comprise a ground plate having a first side edge and a second side edge opposite each other; at least one wireless communication device coupled to the ground plate and positioned on one side of the ground plate; at least one electronic device coupled to the ground plate and positioned on the other side of the shielding plane; and at least one electromagnetic shielding gasket coupled to the first side edge, wherein adjacent ground plates are coupled to each other about respective side edges such that the electromagnetic shielding gasket is disposed between the respective side edges, thereby defining a shielding plane, to electromagnetically shield the electronic devices from the wireless communication devices of the plurality of integrated modules.

In some examples; the at least one electromagnetic shielding gasket can comprise a pair of electromagnetic shielding gaskets to form a double-sided double-D shield. In some examples, the left and right edges of the plurality of ground plates can be offset relative to the shielding plane or more specifically another side of the shielding plane. In some examples, the plurality of ground plates collectively can form a substantially planar surface on the side of the shielding plane of the wireless communication devices.

In some examples; a supplemental plurality of ground plates can be arranged along top edges of the plurality of ground plates and further defining the shielding plane. A plurality of supplemental electromagnetic shielding gaskets can be disposed between top edges of the plurality of ground plates and bottom edges of the supplemental plurality of ground plates. The supplemental plurality of ground plates can have the same right and left edge interfaces as the plurality of ground plates.

In some examples; a method of coupling to each other integrated modules of a wireless communication electronics assembly is disclosed. The method comprises coupling a first ground plate of a first integrated module to a wireless communication electronics assembly. The first ground plate can comprise a first side edge supporting at least one electromagnetic shielding gasket. The method can comprise slidably interfacing a second ground plate of a second integrated module to the first ground plate of the first integrated module. The second ground plate can comprise a second side edge slidably interfaced to the first side edge of the first ground plate, and coupled to the at least one electromagnetic shielding gasket, to provide an electromagnetically shield along the first and second ground plates.

In one example, the method comprises slidably removing the second ground plate from the first ground plate, and further comprises re-interfacing the second ground plate to or with the first ground plate.

FIG. 1 is an isometric view of a wireless communication electronics assembly in the form of an antenna assembly or array 100 comprising an electromagnetic shielding assembly comprising a plurality or an array of integrated modules 102 a-n (e.g., TRIMMs) individually interfaced to one another. FIG. 2 is an isometric view of an example integrated module 102 a, and FIG. 3A is a bottom view of adjacent integrated modules 102 a and 102 b (forming a portion of the electromagnetic shielding assembly), and FIG. 3B is a close up view of interfaced edges of the integrated modules FIG. 3A.

With particular reference to FIGS. 1 and 2, the integrated module 102 a can include ground plate 104 a having a left edge 106 a and a right edge 108 a opposite each other about a generally planar surface 110 a of the ground plate 104 a. in one example, the left edge 106 a can be formed generally as a male coupling member, and the right edge 108 a can be formed generally as a female coupling member (e.g., see FIGS. 3A and 3B). Each edge 106 a and 108 a can extend along the entire elongated length of the ground plate 104 a, or each edge 106 a and 108 a can extend along a portion of the length of the ground plate 104 a.

A plurality of wireless communication devices 112 a (e.g., edge radiating aperture CCAs) can be supported by (e.g., fastened or otherwise secured to) the ground plate 104 a, and positioned on one side W of the ground plate 104 a. A plurality of electronic devices 114 a can be coupled to the ground plate 104 a, and positioned on the other side E of the ground plate 104 a (see also FIG. 3A). The wireless communication devices 112 a can be CCAs or other electronic devices, and the electronic devices 114 a can be any number of active devices, passive devices, circuit boards, integrated devices, heatsinks, capacitors, etc. that are used to assist with operation of the integrated module, for instance.

The integrated module 102 a can comprise an attachment lever 115 a that is actuatable by a user to secure the integrated module 102 a to a housing 101 of the antenna assembly 100, and to remove the integrated module 102 a when desired. As further discussed below, after the integrated module 102 a is slidably inserted into the housing 101 and positioned about or next to an adjacent integrated module, the lever 115 a can be rotated/moved to a locked position to secure the integrated module 102 a to the housing 101 in its operating position. The lever 115 a can be a cam-type mechanism that interfaces with or engages a portion of the housing to lock the integrated module 102 a in place, or it can be another suitable locking mechanism that facilitates locking and unlocking of a particular integrated module to the housing 101. When being inserted and when in proper operating position, the integrated module 102 a is caused to interface with the adjacent integrated module. Conversely, when the integrated module 102 a requires testing or repair or replacement, the attachment lever 115 a can be rotated/moved to an unlocked position to facilitate removal of the integrated module 102 a from the adjacent integrated module, and ultimately removable from the antenna assembly 100. This can be similar for any of the integrated modules 102 a-n within the assembly 100. In this manner, a lower panel of the housing 101 can be removed or opened to allow a user to access a lower inside area of the antenna assembly 100, which exposes the various attachment levers (e.g., 115 a) of the row of integrated modules 102 a-n for a user to lock or unlock into place.

With continued reference to FIGS. 1 and 2, and particular reference to FIGS. 3A and 3B, when adjacent integrated modules 102 a and 102 b are interfaced to each other along respective edges 108 a and 106 b, the adjacent ground plates 104 a and 104 b can define a shielding plane P, as illustrated by the dashed line. The shielding plane P represents an electromagnetic interference (EMI) barrier (or EMI region/area) or ground plane that protects the electronic devices 114 a and 114 b (on side E) from electromagnetic interference imparted by the wireless communication devices 112 a and 112 b (on the side W). Note that the wireless communication devices 112 a and 112 b extend outwardly from respective ground plates 104 a and 104 b, and are parallel to each other (FIG. 3A). And, a particular column of wireless devices 112 a can be vertically aligned relative to each other along ground plate 104 a, for instance (FIG. 2). The wireless communication devices can be arranged closer together in this manner due to the increased EMI shielding performance discussed herein, thereby facilitating a compact assembly with maximized power density emitted from the wireless communication devices compared to similar existing assemblies or systems, as further discussed below.

More specifically, the right edge 108 a of the integrated module 102 a can support or comprise one or more electromagnetic shielding elements, such as a pair of electromagnetic shielding gaskets 116 a and 116 b. In one example, the gaskets 116 a and 116 b may be fabric-over-foam EMI gaskets. The right edge 108 a can be generally formed as a female edge coupling having a channel or groove 119 made up of at least first and second surfaces defining an area that receives or supports the pair of gaskets 116 a and 116 b, and that also receives the edge 106 b of the integrated module 102 b between the gaskets 116 a and 116 b. The groove 119 can extend longitudinally along the length of the right edge 180 a of the ground plate 104 a. Each gasket 116 a and 116 b can be coupled (e.g., adhered or otherwise secured) to opposing first and second inner surfaces of the female type coupling of the right edge 108 a, as shown in FIG. 3B. The gaskets 116 a and 116 b receive (e.g., sandwich) the left edge 106 b of the adjacent ground plate 104 b (e.g., FIG. 3A) of the integrated module 102 b, such that the gaskets 116 a and 116 b tend to pinch or compress the left edge 106 b. In one example; the left edge 106 b can be vertically; slidably interfaced to the right edge 108 a between the gaskets 116 a and 116 b, either from above or below the ground plate 104 a (once ground plate 104 a is coupled to the housing 101 of the antenna assembly 100). Note that the ground plates 104 a and 104 b if FIG. 3A are shown as un-coupled or not interfaced to each other for purposes of illustration clarity. Reference can be made to FIG. 3B for an illustration of the properly interfaced ground plates 104 a and 104 b of adjacent integrated modules 102 a and 102 b.

When the ground plates 104 a and 104 b are interfaced to or with each other as shown in FIG. 3B, gasket 116 a is disposed between a first surface of the male rib 118 of the left edge 106 b and a first surface of a female flange portion 120 of the right edge 108 a. Similarly, the opposing gasket 116 b is disposed between a second surface of the male rib 118 and a second surface of the female portion 122 of the right edge 108 a. As such, the right and left edges 108 a and 106 b of adjacent ground plates 104 a and 104 b, respectively, are spatially separated from each other about the pair of gaskets 116 a and 116 b. Stated differently, the adjacent ground plates do not directly contact each other. Rather, adjacent ground plates are maintained in a spatially separated position relative to one another and tend to float relative to one another by virtue of the pair of gaskets 116 a and 116 b that facilitate the slidable interface coupling of adjacent ground plates, and that function to maintain separation of the ground plates 104 a and 104 b about this interface.

In one example, the male rib 118 can extend longitudinally along the length of the left edge 106 b. This length can correspond to a distance of the length of the groove 119 of the right edge 108 a of the ground plate 104 a, or can comprise some other length. In another aspect, the male rib 118 can be segmented, with the individual segments interfacing with the groove 119 of the right edge 108 a. Each gasket 116 a and 116 b can be a D-shaped gasket (a gasket comprising a “D” shaped cross-section taken along a plane orthogonal to a longitudinal axis of the gasket) that is coupled to respective surfaces of the right edge 108 a and along the flat edge of the “D” shaped profile of each gasket 116 a and 116. Thus, the curved or protruding portion of the D-shaped gaskets can be caused to extend or protrude outwardly to slidably receive and engage the male rib 118 of the left edge 106 b to provide a EMI shielding interface. Such configuration of these dual gaskets 116 a and 116 b shown in FIG. 3B forms a double-sided, dual-D electromagnetic shield between ground plates 104 a and 104 b of adjacent integrated modules 102 a and 102 b. The “D” shaped configuration of the gaskets 116 a and 116 b is not intended to be limiting in any way. Those skilled in the art will recognize that other shapes, profiles, and/or configurations are possible that can also provide an effective electromagnetic shielding interface between adjacent ground plates of adjacent integrated modules. These can include, but are not limited to, double “D” shaped gaskets, “J” shaped gaskets, knife shaped gaskets, square, triangular rectangular, rounded rectangular shaped gaskets, and others, including any of these types having a hollow configuration. Other types of electromagnetic shielding elements are contemplated, such as channel strips, stamping, “D” or other shaped gaskets supported about a clip that could clip to an edge of the integrated modules, and others. Those skilled in the art will also recognize that the gasket(s) or other type(s) of electromagnetic shielding elements can be positioned about any one or both of adjacent integrated modules.

In some examples, only one gasket can be utilized between the right edge 108 a and the left edge 106 b, such as a C-fold gasket, channel strip, etc. For instance, a single strip fabric-over-foam C-fold type of gasket can be disposed in the channel 119, and then the left edge 106 b can be press-fit or slidably engaged to said gasket, whether the gasket is disposed on one side of the male rib 118, or whether the gasket wraps around the tip of the male rib 118, for instance.

In one example, the right edge 108 a and the left edge 106 b, respectively, of adjacent ground plates 104 a and 104 b can be recessed about side E and below the shielding plane P. In this context, “recessed” can mean that the right edge 108 a and the left edge 106 b are offset from the shielding plane P about side E (away from side W), such that there are no features and/or protrusions (i.e., 108 a, 106 b, 116 a, 116 b) extending into side W. In other words, when interfaced, the ground plates 104 a and 104 b generally form a linear, planar surface that extends along all of the interfaced ground plates (e.g., along the line representing shielding plane P), and that is gapless (or nearly or substantially gapless). This means that at least a portion of the ground plates 104 a and 104 b may be in direct contact such that no gap exists through which radio waves can enter, for instance. It can also mean that a very small gap may exist between the ground plates 104 a and 104 b, as on FIG. 3B, so that some radio waves are able to pass through the shielding plane P, but which will ultimately be blocked from passage beyond the ground plates due to the aforementioned tortuous path such waves must travel that is provided by the electromagnetic shielding assembly. In any event, this gapless (or nearly or substantially gapless) configuration is advantageous because, any features extending from such collective planar surface, and disposed on the other side W (on the side having wireless communication devices), can interfere with the signals of the wireless communication devices 112 a and 112 b, which can be highly undesirable for proper performance of the wireless communication devices 112 a and 112 b and of the electronic devices 114 a and 114 b. Therefore, such “recessed” or offset right and left edges 108 a and 106 b, and the defined planar surfaces 110 a and 110 b of the interfaced ground plates 104 a and 104 b, collectively provide a planar, substantially continuous surface along the interfaced integrated modules (e.g., 102 a-102 n, for instance) to shield electronic devices from interfering signals or frequencies emitted by the wireless communication devices 112 a-112 n.

Note that the shielding plane P is illustrated as a planar line; however, those skilled in the art will appreciate that, in practice, the shielding plane P could be a region or area extending along the interfaced left and right edges of adjacent ground plates near the respective gaskets. On that note, the generally 90 degree extension and offset formation of the male rib 118 (relative to and recessed or offset from planar surface 110 b), and the generally 90 degree extension and offset formation of the female portion 120 and the channel formed therein (relative to and recessed or offset from planar surface 110 a), further assist to impede or block electromagnetic energy. This is because, in order to pass from one side W to the other side E, such electromagnetic energy must attempt to travel or turn 90 degrees a total of four times (through the male/female structural interface), and also attempt to pass through/beyond the pair of gaskets 116 a and 116 b. This can be a tortuous and difficult path for electromagnetic energy to travel, therefore this interface can provide an electromagnetic seal between adjacent TRIMMs, for instance, all while providing a line replaceable unit (LRU) system to slidably interface/couple (and slidably remove) such TRIMMs (or other LRU types).

Furthermore, the aforementioned functionality of removing a particular integrated module, then testing it and re-inserting it into the antenna assembly (or replacing it with a new integrated module), provides repeatable EMI shielding effectiveness because of the repeatable and/or interchangeable slidable interfacing of each integrated module along the side edges and dual “D” shaped gaskets. Existing gaskets associated with existing antenna arrays tend to break apart or fall out when removing and replacing various components of the antenna. In the present examples, each integrated module can be individually removed and replaced without affecting the EMI shielding effectiveness of the collective ground plates and EMI gaskets. Thus, each integrated module (e.g., TRIMM) can be an LRU that also provides an EMI barrier while not affecting the RF performance of the antenna aperture.

Moreover, the slidable interfacing of adjacent integrated modules can be achieved with small forces that partially elastically deform or distort the gasket(s) as a particular integrated module is being inserted, thus ensuring a proper and effective shielding interface between the gaskets and the integrated modules. This helps to prevent damage to sensitive electrical components, and assists with repeatability and longevity of a particular integrated module, and ultimately of the antenna assembly.

While an example of one particular shielding interface configuration is described above and shown in the drawings (the male and female edge configurations as specifically shown in FIG. 3B of the drawings), this is not intended to be limiting in any way. Indeed, it will be apparent to those skilled in the art upon reading the disclosure herein that other interfacing edge configurations are possible that provide a similar shielding plane having recessed or offset interfacing features. For example, the structural edge configuration making up the male and female edges of adjacent integrated modules could be formed on angles other than 90 degrees, such as on 45 degrees. This configuration would likely provide similar effective electromagnetic shielding capabilities as the configuration in FIG. 3B. In another example, the interfacing edge configuration can comprise a serpentine-type having one or more EMI gaskets between edges. In such example, the male rib 118 can have a curve linear shape, while the female flange portion 120 can also have a corresponding curve linear shape, with one or more gaskets disposed therebetween. In another example, the male rib 118 and the female flange portion 120 can be formed 90 degrees clockwise from the view of FIG. 3B, whereby the male rib 118 is formed perpendicular to the generally planar surface 110 a. Moreover, a snapping or locking interface could be used. While not listing them all, still others are possible and are contemplated herein. Indeed, upon reading the disclosure of the technology as set forth herein, those skilled in the art will recognize still other coupling or interfacing configurations that could be used while maintaining the spirit of the invention. In any event, the recessed or offset configurations discussed herein can be configured to provide effective EMI shielding, while also providing a mechanism to couple and decouple adjacent TRIMMs, for instance.

Advantageously, interfaced integrated modules as disclosed herein can provide a compact antenna assembly configuration because the wireless communication devices (e.g., CCAs) can be stacked relatively closely together to form the entire array of the antenna assembly, all while providing appropriate EMI shielding as discussed herein. When desiring greater or maximum power density from the CCAs, for instance, greater EMI shielding performance can be provided. Thus, there is a direct correlation between the maximum power density possible (e.g., the number of CCAs) and the level of EMI shielding performance utilized within a particular system. Because each integrated module is slidably interfaced to adjacent integrated modules in parallel and with at least one EMI gasket between adjacent integrated modules, the EMI shielding capabilities are relatively high (e.g., 85 dB or more). Compare this “parallel” configuration to the “in-plane” configuration of existing systems where the wireless communication devices are arranged in-plane with each other, which decreases the space and amount of CCAs that can be incorporated into an antenna array, comparatively speaking.

Therefore, and advantageously, more CCAs can be incorporated into the assemblies disclosed herein because this “increased EMI shielding performance” accounts for the higher power density resulting from the increased number of CCAs. As a result, each wireless communication device (e.g., 112 a, 112 b) can be disposed closer together (e.g., about 0.9 inches apart, or less), and can be arranged parallel to each other along adjacent ground plates, and vertically aligned relative to each other along a given ground plate.

Depending on the system, the LRUs and EMI gaskets and the shielding interface between adjacent integrated modules as discussed herein could provide either primary or secondary EMI shielding for a target system or subsystem. For instance, the wireless communications electronics assembly, and particularly the wireless communication devices, could comprise a cover operable to provide primary EMI shielding when the cover is in place. In this instance, the EMI gaskets or other electromagnetic shielding elements, along with the shielding interface, could provide secondary EMI shielding. When one or more of the covers are removed, such as to obtain access to the individual integrated modules, the electromagnetic shielding interface technology described herein could provide secondary EMI shielding.

FIG. 4A shows a plurality of integrated modules comprising a first or upper row 202 a of upper integrated modules 204 a-n coupled to a second or lower row 202 b of lower integrated modules 204 b-n, thus forming an array, which can be coupled to a housing of an antenna assembly/array (e.g., FIG. 1) in accordance with an example of the present disclosure. Note that the integrated modules of FIG. 4A are shown inverted as compared to those shown in FIG. 2, for purposes of illustration of the gaskets of FIGS. 4A-40. Further note that the terms “upper” and “lower” are used for purposes of referencing the drawings, and should not connote any particular orientation of integrated modules and/or an antenna assembly/array.

With reference to FIGS. 4A-4C, the upper and lower (or first and second) rows of integrated modules 204 a-n can each have side edge interfacing structures configured similar to those of the integrated modules described above. That is, side edges of adjacent integrated modules of the first row 202 a and likewise, side edges of adjacent integrated modules of the second row 202 b, can be interfaced together, such as one at a time sequentially. Thus, the first row 202 a and the second row 202 b can function together to define a shielding plane along the generally planar surface of the collective ground plates 208 a-n of each of the integrated modules 204 a-n across upper and lower rows 202 a and 202 b (along the array of integrated modules).

Notably, an electromagnetic shielding gasket 206 b can be disposed between a bottom edge of the ground plate 208 a of the upper integrated module 204 a and the top edge of the ground plate 208 b of the lower integrated module 204 b, as exemplified in FIG. 40. The electromagnetic shielding gasket 206 b can be a single strip extending along the lateral length of the ground plates 208 a and 208 b between upper and lower ground plates 208 a and 208 b, or the gasket 206 b can be an individual gasket coupled between adjacent upper and lower ground plates 208 a and 208 b (as in the example shown in FIG. 4C). As exemplified in FIG. 4B, a particular single gasket 206 a can be coupled or otherwise secured to the top edge of the ground plate 208 a, so that when the integrated module 204 a is slidably interfaced to an adjacent/lateral integrated module, the gasket 206 a is sandwiched or biased between the top edge of the ground plate 208 a and a bottom edge of an upper ground plate of an upper integrated module (not shown). This final coupling interface is shown in FIG. 4C, where the gasket 206 b could be coupled (e.g., adhered or otherwise secured) to the top edge of the ground plate 208 b, so that when the integrated module 204 b is slidably interfaced to an adjacent/lateral integrated module along the bottom row 202 b, the gasket 206 b would be sandwiched or biased between ground plates 208 a and 208 b of upper and lower integrated modules 204 a and 204 b, respectively. This configuration provides EMI shielding along the x-y planes of the collective ground plates 208 a-n of the upper and lower (or first and second) rows 202 a and 202 b of the integrated modules 204 a-n.

In one example, the gasket 206 b can be recessed or offset relative to planar surfaces of the ground plates 208 a and 208 b, for instance, such as described above with reference to FIGS. 1-3B. In this manner, the gasket 206 b can be coupled (e.g., adhered) to the top edge of the ground plate 208 b and can comprise an O-shape or D-shaped profile. And, the bottom edge of the ground plate 208 a can comprise a recessed channel that receives a portion of the gasket 206 b. Thus, when the integrated module 204 b is slidably, vertically interfaced to an adjacent/lateral integrated module (e.g., slid-in from below) of the lower row 202 b, the gasket 206 b on top of the ground plate 208 b of the integrated module 204 b can be received in the corresponding recessed channel of the ground plate 208 a of the integrated module 204 a of the upper row 202 a. Thus, no portion of the gasket 206 b would extend or protrude beyond the generally planar surfaces of the adjacent ground plates 208 a-n, which further assists to provide an effective EMI barrier between either side of the rows and columns (the array) of interfaced ground plates 208 a-n of the antennae assembly.

Although the above discussion focuses on a wireless communication electronics assembly in the form of an antenna assembly, it is contemplated that the shielding technology described herein can be applicable to other wireless communications electronics assembly types. With reference to FIG. 5, illustrated is an example generic electromagnetic shielding assembly 300 that comprises adjacent integrated modules 302 a and 302 b interfaced to each other along respective edges 108 a and 106 b (edge 108 a being opposite edge 106 a of integrated module 302 a, and edge 106 b being opposite edge 108 b of integrated module 302 b). The adjacent ground plates 104 a and 104 b can be configured as described above with respect to FIGS. 3A and 3B, and can define a shielding plane P, as illustrated by the dashed line. As taught above, the shielding plane P represents an electromagnetic interference (EMI) barrier (or EMI region/area) or ground plane that protects electronic devices 314 a and 314 b (on side E) from electromagnetic interference imparted by the wireless communication devices 312 a and 312 b (on the side W).

Notably, FIG. 5 illustrates that the ground plate interface configuration disclosed herein (e.g., FIG. 3B) can be implemented in many different assemblies, subassemblies, systems, etc. As such, an antennae assembly is not intended to be limiting in any way. Generally speaking, at least one wireless communication device 312 a (e.g., any device capable of receiving and/or transmitting a signal) can be coupled (or otherwise secured or disposed) to the ground plate 104 a on side W, while at least one electronic device 314 a can be coupled (or otherwise secured or disposed) to the ground plate 104 a on side E. Likewise, at least one wireless communication device 312 b (e.g., any device capable of receiving and/or transmitting a signal) can be coupled (or otherwise secured or disposed) to the ground plate 104 b on side W while at least one electronic device 314 b can be coupled (or otherwise secured or disposed) to the ground plate 104 b on side E. For instance, the wireless communication devices 312 a and 313 b can be those associated with a signal-transmitting device or system, such as radios (AM/FM), computers, televisions, jammers (e.g., those used in military applications), and the like.

The examples described herein can provide greater than 85 dB of isolation at the edge interface between adjacent ground plates (whether at the vertical or horizontal interfaces discussed herein). Of course, those skilled in the art will recognize that other values can be achieved depending upon the configuration and overall design of the assembly. For example, the dB of isolation can be dependent upon the materials used, the configuration of the electromagnetic shielding assembly, the number of wireless communication devices used, the configuration and makeup of the shielding gasket(s), etc., and as such, this is only intended as an example. Indeed, with other configurations of the wireless communications electronics assembly the isolation at the edge interface could be as high as 120 dB (or more). In one example, this can be achieved by changing the materials used, such as by using certain metals for ground plates that exhibit certain EMI shielding capabilities, or by selecting EMI gasket material that has increased silver therein, thereby increasing the amount of EMI shielding capabilities. Moreover, using a fabric-over-foam core EMI gasket ensures long-term reliability and repeatability of sliding shield performance. This is desirable when a single, individual integrated module requires removal, testing, and/or replacement (or re-insertion), for example. Individual removability is advantageous because it prevents the requirement for a user to remove the entire antenna array in order to test or replace a single integrated module.

While the foregoing examples are illustrative of the principles of the present invention in one or more particular applications, it will be apparent to those of ordinary skill in the art that numerous modifications in form, usage and details of implementation can be made without the exercise of inventive faculty, and without departing from the principles and concepts of the invention. Accordingly, it is not intended that the invention be limited, except as by the claims set forth below. 

What is claimed is:
 1. An electromagnetic shielding assembly of a wireless communication electronics assembly, the assembly comprising: a plurality of ground plates interfaced to each other and defining a shielding plane, the ground plates in support of wireless communication devices on one side of the shielding plane, and electronic devices supported on the other side of the shielding plane, wherein each ground plate includes a left edge and a right edge opposite each other; and at least one electromagnetic shielding element disposed between the left edge and the right edge of adjacent ground plates to electromagnetically shield the plurality of electronic devices from the plurality of wireless communication devices.
 2. The assembly of claim 1, wherein the at least one electromagnetic shielding element comprises an elastically deformable electromagnetic shielding gasket.
 3. The assembly of claim 1, wherein the left and right edges of the plurality of ground plates are offset relative to the other side of the shielding plane.
 4. The assembly of claim 1, wherein the plurality of ground plates collectively form a substantially planar surface on the side of the shielding plane having the wireless communication devices.
 5. The assembly of claim 1, wherein the at least one electromagnetic shielding element comprises a plurality of electromagnetic shielding gaskets disposed between said left edge and said right edge of adjacent ground plates, respectively, in a manner, such that said right edge is maintained in a spatially separated position from said left edge upon interfacing the adjacent ground plates.
 6. The assembly of claim 5, wherein one of the pair of electromagnetic shielding gaskets is disposed between a first side of a rib of said right edge and a first surface of the groove of said left edge, and the other one of the pair is disposed between a second side the rib of said right edge and a second surface of the groove of said left edge to form a double-sided electromagnetic seal.
 7. The assembly of claim 1, wherein the plurality of ground plates slidably interface with one another along at least some of their respective edges.
 8. The assembly of claim 2, further comprising a supplemental plurality of ground plates arranged along top edges of the plurality of ground plates and further defining the shielding plane, the supplemental plurality of ground plates forming a different row.
 9. The assembly of claim 8, further comprising a plurality of supplemental electromagnetic shielding elements, each supplemental electromagnetic shielding element disposed between top edges of the plurality ground plates and bottom edges of the supplemental plurality of ground plates, respectively.
 10. The assembly of claim 8, wherein the plurality of supplemental ground plates are interfaced to each other and further define the shielding plane, the supplemental ground plates in support of supplemental wireless communication devices on one side of the shielding plane, and supplemental electronic devices supported on the other side of the shielding plane, wherein each supplemental ground plate includes a left edge and a right edge opposite each other.
 11. The assembly of claim 10, further comprising a pair of electromagnetic shielding elements disposed between the left edge and the right edge of adjacent supplemental ground plates to electromagnetically shield the plurality of supplemental electronic devices from the plurality of supplemental wireless communication devices.
 12. A wireless communication electronics assembly having high-performance electromagnetic shielding, the assembly comprising: a housing; an electromagnetic shielding assembly comprising a plurality of integrated modules removably coupled to each other, each integrated module comprising: a ground plate having a first side edge and a second side edge opposite each other; at least one wireless communication device coupled to the ground plate and positioned on one side of the ground plate; at least one electronic device coupled to the ground plate and positioned on the other side of the shielding plane; and at least one electromagnetic shielding element coupled to the first side edge, wherein adjacent ground plates are coupled to each other about respective side edges, such that the electromagnetic shielding element is disposed between the respective side edges, thereby defining a shielding plane, to electromagnetically shield the electronic devices from the wireless communication devices of the plurality of integrated modules.
 13. The assembly of claim 12, wherein the at least one electromagnetic shielding element comprises an electromagnetic shielding gasket.
 14. The assembly of claim 12, wherein the side edges of the each ground plates are offset relative to the other side of the shielding plane.
 15. The assembly of claim 12, wherein the plurality of ground plates collectively form a substantially planar surface on the side of the shielding plane of the wireless communication devices.
 16. The assembly of claim 12, wherein the at least one electromagnetic shielding element comprises a pair of electromagnetic shielding gaskets disposed between the first side edge of one ground plate and the second side edge of an adjacent ground plate.
 17. The assembly of claim 16, wherein one of the pair of electromagnetic shielding gaskets is disposed on one side of a rib of said second side edge and a groove of said second side edge, and the other one of the pair is disposed on the other side of the rib and the groove to form a double-sided electromagnetic seal.
 18. The assembly of claim 12, further comprising a supplemental plurality of integrated modules, each having a ground plate, arranged along top edges of the ground plates of the plurality of integrated modules, and further defining the shielding plane.
 19. The assembly of claim 18, further comprising a plurality of supplemental electromagnetic shielding elements, each supplemental electromagnetic shielding element disposed between top edges of the plurality ground plates and bottom edges of the ground plates of the supplemental plurality of integrated modules.
 20. The assembly of claim 19, wherein the ground plates of the plurality of supplemental integrated modules are interfaced to each other and further defining the shielding plane, said ground plates in support of supplemental wireless communication devices on one side of the shielding plane, and supplemental electronic devices supported on the other side of the shielding plane.
 21. The assembly of claim 20, further comprising at least one electromagnetic shielding element disposed between adjacent ground plates of the supplemental integrated modules to electromagnetically shield the plurality of supplemental electronic devices from the plurality of supplemental wireless communication devices.
 22. A method of coupling to each other integrated modules of a wireless communication electronic assembly, comprising: coupling a first ground plate of a first integrated module to a wireless communication electronic assembly, the first ground plate having a first edge comprising at least one electromagnetic shielding element; and slidably interfacing a second ground plate of a second integrated module to the first ground plate of the first integrated module, the second ground plate comprising a second edge slidably interfaced to the first edge of the first ground plate, and coupled to the at least one electromagnetic shielding element, to provide an electromagnetic shield along the first and second ground plates.
 23. The method of claim 22, wherein slidably interfacing the second ground plate is initiated vertically about a lower end or upper end of the first ground plate.
 24. The method of claim 22, further comprising sequentially slidably interfacing a plurality of ground plates to one another after interfacing the first ground plate and the second ground plate to generate a first row of integrated modules, thereby defining a shielding plane along the ground plates of the first row of integrated modules.
 25. The method of claim 24, further comprising interfacing a plurality of ground plates together to form a second row of integrated modules, and positioning these adjacent the first row of integrated modules, and disposing at least one electromagnetic shielding element between the first and second rows of integrated modules, thereby defining a shielding plane along the first and second rows of integrated modules.
 26. The method of claim 22, further comprising slidably removing the second ground plate from the first ground plate, and further comprising re-interfacing the second ground plate to the first ground plate. 